1. Introduction

Polyimide resin PI-100 is one of the advanced composite matrix resin varieties, widely used in high performance, high temperature resistant resin matrix composites, can replace Kerimid601 polyimide resin. Mainly used for (diamond, cubic boron nitride) grinding wheel and friction material binder and matrix resin of high temperature resistant molding parts, also suitable for the preparation of high (low) temperature resistant solid self-lubricating mechanical parts. The product has high glass transition temperature; Excellent heat resistance and mechanical properties; Excellent electrical performance; Good storage stability and other advantages. The product is hot pressed and can also be dissolved with organic solvent (DMF, etc.) to prepare fiber (glass fiber, carbon fiber, etc.) reinforced prepreg. After dissolving and blending with different epoxy resins, a variety of new epoxy resin system can be prepared to meet the requirements of different composite materials and electrical insulation materials on the heat resistance of epoxy resins.